improve these two qualities of connections will increase the amount and speed of information that can flow through a computer. This was considered Paul Kohl, a professor in the School of Chemical and Biomolecular Engineering Georgia Institute of Technology.
The vertical connections between chips and boards today are made by melting tin solder between the pin an another, and adding glue to hold it all together. Kohl's research shows that replacing traditional solder connections with copper pillars creates stronger connections and allows a greater number of them. Both
tin and copper can tolerate misalignment between two pieces being connected, but copper is more conductive and creates a stronger bond.
Kohl and Tyler Osborn have developed a novel manufacturing method for creating fully copper connections between chips and external circuitry.
Researchers have been working with companies Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl and Sue Ann Allen, both of Georgia Tech have also contributed to the work.
In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing a line of improved signal transmission, with the help of Todd Spencer.
In a computer there are several very long communication pathways that require very high power line efficiency that can be transmitted at high frequencies over long distances.
This is especially important in high-performance servers and routers where the gap between the chips can be large and signal strength may be degraded significantly. Kohl and Spencer have developed a new method for connecting high-speed signals between chips using an organic substrate.
Researchers are designing a coaxial cable for this chip signal link chip, which should greatly increase the maximum signal frequency that can carry the connection.
Companies that make chips and packaged in a device are very interested in technologies that provide these optimizations.
If these connections can occur at a reasonable cost, could be very important in the future because it would giving the customer a better product for the same cost.
The vertical connections between chips and boards today are made by melting tin solder between the pin an another, and adding glue to hold it all together. Kohl's research shows that replacing traditional solder connections with copper pillars creates stronger connections and allows a greater number of them. Both
tin and copper can tolerate misalignment between two pieces being connected, but copper is more conductive and creates a stronger bond.
Kohl and Tyler Osborn have developed a novel manufacturing method for creating fully copper connections between chips and external circuitry.
Researchers have been working with companies Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl and Sue Ann Allen, both of Georgia Tech have also contributed to the work.
In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing a line of improved signal transmission, with the help of Todd Spencer.
In a computer there are several very long communication pathways that require very high power line efficiency that can be transmitted at high frequencies over long distances.
This is especially important in high-performance servers and routers where the gap between the chips can be large and signal strength may be degraded significantly. Kohl and Spencer have developed a new method for connecting high-speed signals between chips using an organic substrate.
Researchers are designing a coaxial cable for this chip signal link chip, which should greatly increase the maximum signal frequency that can carry the connection.
Companies that make chips and packaged in a device are very interested in technologies that provide these optimizations.
If these connections can occur at a reasonable cost, could be very important in the future because it would giving the customer a better product for the same cost.
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