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extensometer for measuring strain and effort

SCAIME, French specialist in strain gage sensors, EPSIMETAL launches a new miniature extensometer with a high level output (0-5 V) and compensation Digital temperature display.

Conditioning gauge bridge integrated, digitally adjustable via an RS232 connection allows a high level output and compensation of thermal expansion of any material.

EPSIMETAL The low stiffness allows a measuring range of 1 000 microns / m, with a resolution of at least 1 micron / m, both in tension and compression. And thanks to a patented preload that compensates the efforts of the sensitive element, the deviation from zero is zero and the repeatability is excellent.

can be installed with four screws or pasting it directly using templates phones, which can be machined or manufactured to form bracket where they will be placed (eg, in columns of different diameters). It is therefore EPSIMETAL can be reused many times as desired.

Examples of applications include measuring the voltage of a column in injection molding, control effort applied in welding guns, Voltage control in building structures or works of art and weight of trucks or trailers.

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ADD presents a single-chip solution for PLC communications

Advanced Digital Design, SA, (Fab-less) private equity, announces the ADD1000AQF128, a single-chip solution for expansion communications over power narrow-band (PLC).

The new silicon chip is characterized by implementing a full PLC node and a microcontroller ADD8051 have additional functions, a circuit Medium Access Control (MAC) and a cable modem and communications coprocessor, performing frame detection and correction errors. The MAC circuit acts as a liaison between the microcontroller and the modem.

The ADD1000AQF128 also includes a PLC modem digital signal processing to provide the system reliability and robustness far superior to any other device on the market PLC

Therefore, this new chip provides everything you need OEMs believe that PLC systems robust, compact and low cost. ADD

complete its holder with different kits (KIT AMR PLC, PLC STATER KIT, GPRS and PLC DEMO KIT STARTER KIT) and reference cards (ADD7232) for new single-chip solution.

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narrow band of copper connections to improve

improve these two qualities of connections will increase the amount and speed of information that can flow through a computer. This was considered Paul Kohl, a professor in the School of Chemical and Biomolecular Engineering Georgia Institute of Technology.

The vertical connections between chips and boards today are made by melting tin solder between the pin an another, and adding glue to hold it all together. Kohl's research shows that replacing traditional solder connections with copper pillars creates stronger connections and allows a greater number of them. Both

tin and copper can tolerate misalignment between two pieces being connected, but copper is more conductive and creates a stronger bond.

Kohl and Tyler Osborn have developed a novel manufacturing method for creating fully copper connections between chips and external circuitry.

Researchers have been working with companies Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl and Sue Ann Allen, both of Georgia Tech have also contributed to the work.

In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing a line of improved signal transmission, with the help of Todd Spencer.

In a computer there are several very long communication pathways that require very high power line efficiency that can be transmitted at high frequencies over long distances.

This is especially important in high-performance servers and routers where the gap between the chips can be large and signal strength may be degraded significantly. Kohl and Spencer have developed a new method for connecting high-speed signals between chips using an organic substrate.

Researchers are designing a coaxial cable for this chip signal link chip, which should greatly increase the maximum signal frequency that can carry the connection.

Companies that make chips and packaged in a device are very interested in technologies that provide these optimizations.

If these connections can occur at a reasonable cost, could be very important in the future because it would giving the customer a better product for the same cost.