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Trackers Competition, High and warbots in INTERCON UPAO 2008

Trackers

The days Thursday August 7 was launched Trackers robots to contest followed by the Sumo robot competition.

robots for competition trackers with 16 participants had two simultaneous competing.



The list of participants is as follows: 1 .-

Pelabot ACEL
2 .- El Bicho
Protobot 3 .- 4 .- Theft

3001 5 .- Gumaro
C2 PL 6 .- 7 .-
Yal
Tiritron 8 .- 9 .-
Hebito
Zagume 10 .- 11 .-
Patbot
12 .- Kantuta
Basik 13 .- 14.-Pipo
II
Pupitobo 15 .- 16 .-
Crabot



In the first test performed 8 entered the second round and were

1. Zagume
2. 3001 Robo
3. Gumaro
4. Pipo II
5. Protobot
6. Patbot
7. Hebito
8. Acel Pelabot

The final took place days Friday with the participation of the 4 finalists, which were: Gumaro , Theft 3001, and Zagume Basik.

At the end of the third test the winner was Zagume now two-time champion with a time of 43.08.

High

For the second competition held the same day Thursday, he told with participation of 8 competitors who gave the best on the track.

The participants were: 1 .- Apollo II
Java
2.-3 .- Omnibot
MegaBot 4 .- 5 .-
Sager
Harakiri 6 .- 7.-David
1.0
8 .- Crabot

The winner of this match was Crabot who beat MegaBot



warbots

In the last competition held on Friday days warbots was told with participation of 6 robots but unfortunately only four function properly

At the beginning there was some damage to the opponents that many were able to sort of solved.

The fight was close, hit after hit while people wanted see pieces flying.

After a tough battle that was won by Jackal took blow after blow deserved award.

Participants gave a good show thus took a deserved applause winners and losers.

And that was all robots in this event, hopefully for the next great improvement over that we have seen now.

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Robot Contest 2008

Preparations began for the robot contest NTERCON 2008, to be held on days Thursday August 7 at 9 this morning in the pavilion D of the university. The event is divided into several categories such as trackers and juice.

Participants have the university laboratories for testing and necessary adjustments to their units.

can use test tracks to correct errors and train their robots.

Here post some pictures of the robots involved ...

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Conferences INTERCON INTERCON 2008 2008

and began the XV International Conference on Electrical Engineering, Electronics and Systems.

The collection of credentials was held at the university library so fast, at least mine gave me fast ... jejej


In the morning he set out the first tutorial by Marco Miranda Cano research engineer robotics ...



After disposal the afternoon is the first conference which fill some audiences ...



At the end of the conference was held INTERCON the inauguration of 2008 with the participation of one of the founders of the IEEE in Peru Don José Valdez ...

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Monitorization

04 August, the XV International Congress of Electrical Engineering , Electronics and Systems INTERCOM Private University Antenor Orrego , the event will feature international exponents, robot contest, fair technological, cultural night and more.

Entries and are more open information on your website main :

http://ewh.ieee.org/sb/peru/upao/

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INTERCON ESA

By implementing ESA, short for Enthusiast System Architecture ", manufacturers of PCs and advanced users will be able to fine tune their equipment with high much better than we could do until now. ESA is very similar to any other mechanism for communication between devices. The difference is that now, devices that previously could not communicate, such as power supplies, cash and liquid cooling systems, for example, may do so if they incorporate ESA technology. Data such as temperature, voltage, air flow, etc ... are essential for maximum performance and overclocking techniques applied in high-end PCs are accessible in real time through ESA. ESA provides a standard way to communicate all these devices, and offers all of these devices could not previously communicate with other system components, doing so, and thus can be controlled by the user
.

SilverStone, a pioneer in implementing the ESA Standard, has created a series of proprietary products certified for ESA, among which we find the Commnander monitoring module 01.

Systems This module marketed by Ibertrónica, Commnarder 01, allows users the ability to monitor and control the operation of the thermal system. When connected to an ESA certified motherboard, a proportional comprehensive monitoring and thermal control system, supporting up to 5 fans, 3 lamps (optional) and 4 sensors heat. Operates under the control panel nVidia ESA software, and you do not need more complicated BIOS settings to adjust the system performance. For the enthusiast this is without doubt the best choice for precise control of all parameters of your system.

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Ibertronica Lighting systems with light-emitting diodes

Nelson Tansu, Professor in the department of electrical engineering and computing, and Volkmar Dierolf, professor of physics, both at Lehigh University, has received a three-year grant from the Department of Energy United States study methods can improve the efficiency of light emitting diodes (LEDs for their acronym in English) white.

The electricity for lighting is an important rate. For example, in the United States, about 22 percent of electricity used for lighting.

But when using this energy to light by an incandescent lamp, over 95 percent of this energy is dissipated as heat or infrared light invisible.

A typical fluorescent lamp is about four times more efficient than incandescent bulbs, but it contains mercury, which can pose some environmental and health risks.

A much better option lies in the solid state lighting, a technology that is supported by the LEDs, in which light is emitted from semiconductor materials. LEDs used for backlighting liquid crystal displays in notebook computers and televisions, as well as displays of mobile phones and car dashboards, and are also used in an increasing number of traffic signals and highway billboards and cities.

LED technologies that color these electronic displays have the potential to increase 10 to 15 times or more the energy efficiency of a typical incandescent bulb. LED technology also promises to reach two to three times energy efficient fluorescent lamps.

By significantly improving the efficiency of 22 percent of the electricity we use today for lighting, solid state lighting can significantly reduce the global demand for energy, while lighting systems provide more robust and environmentally safe.

light generated by an LED is emitted from a semiconductor material, usually indium gallium nitride (InGaN) or gallium phosphide (GaP), within the LED. A semiconductor is an element or compound that transmits electricity under certain conditions.

A semiconductor light emitting InGaN blue parts and green spectrum, and a semiconductor GaP emits light in the red spectrum. A white LED to mix these colors in the correct proportion to produce white light. This can be done by converting the wavelength or by mixing colors, which combine multiple LEDs, each the size of a human hair, in a single lamp to produce white light.

The problem is the relative inefficiency of the green light produced by an LED. When combined with red LED light and the blue LED to produce white light, this inefficiency limits the overall radiation efficiency white LED light.

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IPod and IPhone-powered

Several U.S. newspapers today assert that Apple has issued a patent for integrating photo voltaic cells in portable electronic devices with LCD screens .

The text of the patent explains that "solar cells embedded in the handset supply the power needed to recharge the batteries."

Specifically, the cells would be placed under the LCD screens of these devices, making the mobile phone iPhone, whose surface is occupied almost entirely by a touch screen, a good candidate for this new technology.

Apple has not done so far statements this patent.

The integration of photo voltaic cells an organically solve the problems of high consumption of portable electronic devices such as mobile phones. Apple , however, is not the first company to experiment with this technology.

Last year, the U.S. group Motorola developed a screen for mobile phones that allows the passage of 75 percent of sunlight, thus enabling the installation of photo voltaic cells underneath.

Meanwhile, mobile operator Vodafone announced in April plans to manufacture mobile rechargers would work with solar energy in its project to reduce by 50 percent their emissions of CO 2 in 2020. EFE

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solar silicon circuits that can stretch and bend

(ANI): The notion that silicon can be used in such applications is surprising because it is intrinsically brittle and rigid. By

structural configurations and carefully optimized mechanical designs, researchers can use silicon in integrated circuits that are fully foldable and resilient.

The new design and manufacturing strategies could produce systems for medical therapies and monitoring of personal health that can be used as clothing, or systems capable of wrapping mechanical parts such as wings and fuselage of aircraft to monitor structural properties.

In 2005, John Rogers, Professor of Science and Engineering of Materials at the University of Illinois, and his research group were able to develop a form of silicon rubber. That configuration allows reversible stretching in one direction without significantly altering the electrical properties.

Now, Roger and his colleagues at the University of Illinois, Northwestern University, and Institute of Computing High Performance in Singapore have managed to extend this basic concept to many other directions, and a much more sophisticated systems to produce fully functional integrated circuits.

The researchers constructed integrated circuits consisting of transistors, oscillators, logic gates and amplifiers. The circuits exhibited extreme levels of flexibility and elasticity, with electronic properties comparable to those of similar circuits built on conventional silicon wafers.

The new design and construction strategy represents a general and scalable route to foldable electronic devices and high-performance elastic, which can incorporate inorganic electronic materials useful features and well known, but too fragile and brittle to make it viable to use them that way without the help of this innovative strategy.

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Precision control of movement in robots

A research team from the Department of Electrical and Electronics, Faculty of Science and Technology in Leioa (UPV / EHU), led by Professor Victor Etxebarria, studies the characteristics of various types of materials for subsequent use in the generation and measurement of precise movements.

At the time of pick up an egg or a light bulb with the arms of a robot is essential to do so as accurately as possible. Therefore, the progress of science and technology of materials have led to the design and control of systems equipped with sensors and actuators built with new materials.

Auto Group, Department of Electrical and Electronics, Faculty of Science and Technology studies the stimulus-response characteristics of various types of materials used in the generation and measurement of precise movements in electromechanical systems in miniature and in robotics.

Specifically, the studies focus on two types of materials with promising properties for micro positioning applications: shape memory alloys (SMA) and shape memory alloys, magnetic or ferromagnetic (MSM or FSMA). They are all new materials, classified as intelligent for their ability to memorize the shape and other novel properties.

The shape memory alloys are capable of remembering their original size and shape even after having undergone a deformation process. The most common of these alloys are generically known as nitinol, being composed of nickel and titanium, almost 50%. There is often sold commercially in the form of threads.

The shape memory alloys are magnetic ferromagnetic materials capable of withstanding large transformations that are reversible both in shape and size, under applicable a magnetic field. There are currently commercially manufactured only in research laboratories.

The team built a number of potentially useful devices for robotics, using these shape memory materials, and investigated new applications fundamentally aimed at light or electromechanical systems in miniature.

Laboratory prototypes

The use of SMA as actuators in low-precision applications is not particularly novel. However, researchers at the UPV / EHU have developed some experimental devices that radically improve the control of positioning of these actuators. As a result, have built a prototype of a light grip for a flexible robot of small dimensions, capable of handling small objects. For this, they placed nitinol wire between two elastic metal sheets so that if the thread is applied an electric current, the sheets contract and the claws are closed entirely, collecting small objects around it. Without such power, the claws open completely. However, the research group of the UPV / EHU has improved the movement to open and close, reaching position that movement with an accuracy of a micron. The accuracy of one micron may be sufficient in many applications, eg in machine tools.

regard to shape memory alloys, magnetic and ferromagnetic, the researchers at the UPV / EHU has designed a device which has managed to position objects with an accuracy of about 20 nanometers. Being a handmade device with a simple control system, researchers do not doubt that it can be improved. It can also be a serious candidate to replace the current high precision devices, as positioning devices made of shape memory alloys are ferromagnetic great advantage that, once suitably positioned non energy. The use of FSMA actuators can be very important in some applications, for example, large telescopes, which have many mirrors that have to move with great precision to focus properly.

All these appliances, craft time, serve to prove the basic characteristics of the materials in the laboratory, but maybe in the future may become final commercial prototypes of robotic devices and micro and nanopositioning.

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HP demonstrates an efficient electronic component frequency memristor

physically HP has demonstrated something that was just a theory, with its discovery would be best to start a team and not start appearing directly in the same state as when you went out without spending energy. (DT, AGENCIES) Known as the fourth element of the circuit has been discussed in scientific circles for decades, but has never been shown so far, the company said . The HP team leader Stanley Williams, who described the breakthrough as "a big surprise," he said, "By providing a mathematical model for the physics of a memristor, HP Labs has made it possible for engineers to develop integrated circuit designs can improve performance and energy efficiency. "Memristor HP says it could eventually replace DRAM as the most effective and advanced memory in wide use.

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Record in microresonator

(ANI): This is the highest frequency achieved to date in silicon, with a quality factor close to 10,000.

The quality factor, which is, among other things, a measure of the amount of stored energy in an oscillator, usually decreases with increasing frequency.

The new device consists of a silicon bar set into vibration by a process called "dielectric transduction." An alternating voltage is applied to a rod electrode separated by an insulator. The attractive forces between electric charges of the electrode and the bar create mechanical vibrations that travel along the bar from one end the other of it, like sound waves in a flute or a pipe of an organ.

Previously, researchers had used an air gap as the dielectric. Substituting this for a solid dielectric is easier to obtain the oscillations at higher frequencies, but the solid dielectric damps vibrations and reduces power transmission efficiency of the oscillator.

Dana Weinstein found by mathematical analysis that efficiency could be increased by moving the dielectric layers from the ends of the bar down the middle. The ideal positions are two-thirds of distance from the center the bar towards the end. These locations are the points of maximum stress when there is vibration.

The resulting device is a silicon bar of 8.5 microns long, 40 meters wide and 2.5 thick, divided by two dielectric layers of silicon nitride only 15 nanometers thick.

According to the researchers, the method could produce resonators with frequencies exceeding 10 GHz.

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extensometer for measuring strain and effort

SCAIME, French specialist in strain gage sensors, EPSIMETAL launches a new miniature extensometer with a high level output (0-5 V) and compensation Digital temperature display.

Conditioning gauge bridge integrated, digitally adjustable via an RS232 connection allows a high level output and compensation of thermal expansion of any material.

EPSIMETAL The low stiffness allows a measuring range of 1 000 microns / m, with a resolution of at least 1 micron / m, both in tension and compression. And thanks to a patented preload that compensates the efforts of the sensitive element, the deviation from zero is zero and the repeatability is excellent.

can be installed with four screws or pasting it directly using templates phones, which can be machined or manufactured to form bracket where they will be placed (eg, in columns of different diameters). It is therefore EPSIMETAL can be reused many times as desired.

Examples of applications include measuring the voltage of a column in injection molding, control effort applied in welding guns, Voltage control in building structures or works of art and weight of trucks or trailers.

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ADD presents a single-chip solution for PLC communications

Advanced Digital Design, SA, (Fab-less) private equity, announces the ADD1000AQF128, a single-chip solution for expansion communications over power narrow-band (PLC).

The new silicon chip is characterized by implementing a full PLC node and a microcontroller ADD8051 have additional functions, a circuit Medium Access Control (MAC) and a cable modem and communications coprocessor, performing frame detection and correction errors. The MAC circuit acts as a liaison between the microcontroller and the modem.

The ADD1000AQF128 also includes a PLC modem digital signal processing to provide the system reliability and robustness far superior to any other device on the market PLC

Therefore, this new chip provides everything you need OEMs believe that PLC systems robust, compact and low cost. ADD

complete its holder with different kits (KIT AMR PLC, PLC STATER KIT, GPRS and PLC DEMO KIT STARTER KIT) and reference cards (ADD7232) for new single-chip solution.

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narrow band of copper connections to improve

improve these two qualities of connections will increase the amount and speed of information that can flow through a computer. This was considered Paul Kohl, a professor in the School of Chemical and Biomolecular Engineering Georgia Institute of Technology.

The vertical connections between chips and boards today are made by melting tin solder between the pin an another, and adding glue to hold it all together. Kohl's research shows that replacing traditional solder connections with copper pillars creates stronger connections and allows a greater number of them. Both

tin and copper can tolerate misalignment between two pieces being connected, but copper is more conductive and creates a stronger bond.

Kohl and Tyler Osborn have developed a novel manufacturing method for creating fully copper connections between chips and external circuitry.

Researchers have been working with companies Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl and Sue Ann Allen, both of Georgia Tech have also contributed to the work.

In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing a line of improved signal transmission, with the help of Todd Spencer.

In a computer there are several very long communication pathways that require very high power line efficiency that can be transmitted at high frequencies over long distances.

This is especially important in high-performance servers and routers where the gap between the chips can be large and signal strength may be degraded significantly. Kohl and Spencer have developed a new method for connecting high-speed signals between chips using an organic substrate.

Researchers are designing a coaxial cable for this chip signal link chip, which should greatly increase the maximum signal frequency that can carry the connection.

Companies that make chips and packaged in a device are very interested in technologies that provide these optimizations.

If these connections can occur at a reasonable cost, could be very important in the future because it would giving the customer a better product for the same cost.